Flip Chip TVS

Note : Other chip specifications such as breakdown voltage(VBR), chip size and thickness are available on demand.

Product Name	Vz(V)	Chip Size (μ㎡)	Thickness (μm)	Electrode (Top/Bottom)	Pad Size(μ㎡)	Structure
Leteral Bidirectional (PNP) and Unidirectional (PN) Structure
FCAD08V-4121-T3-C	-8 / +8	415 x 210	150	Au80wt%Sn20wt% / Si	40 x 30 x 2
FCAD12V-4121-T3-C	-12 / +12	415 x 210	150	Au80wt%Sn20wt% / Si	40 x 30 x 2
FCAD15V-4121-T3-C	-15 / +15	415 x 210	150	Au80wt%Sn20wt% / Si	40 x 30 x 2
FCAD20V-4121-T3-C	-20 / +20	415 x 210	150	Au80wt%Sn20wt% / Si	40 x 30 x 2
FCAD26V-4121-T3-C	-26 / +26	415 x 210	150	Au80wt%Sn20wt% / Si	40 x 30 x 2
FCAD36V-4121-T3-C	-36 / +36	415 x 210	150	Au80wt%Sn20wt% / Si	40 x 30 x 2
FCAD47V-4121-T3-C	-47 / +47	415 x 210	150	Au80wt%Sn20wt% / Si	40 x 30 x 2
FCAD08V-4121-T3-D	-8 / +8	415 x 210	150	Au / Si	40 x 30 x 2
FCAD12V-4121-T3-D	-12 / +12	415 x 210	150	Au / Si	40 x 30 x 2
FCAD15V-4121-T3-D	-15 / +15	415 x 210	150	Au / Si	40 x 30 x 2
FCAD20V-4121-T3-D	-20 / +20	415 x 210	150	Au / Si	40 x 30 x 2
FCAD26V-4121-T3-D	-26 / +26	415 x 210	150	Au / Si	40 x 30 x 2
FCAD36V-4121-T3-D	-36 / +36	415 x 210	150	Au / Si	40 x 30 x 2
FCAD47V-4121-T3-D	-47 / +47	415 x 210	150	Au / Si	40 x 30 x 2
FCAD07V-4722-T3-E	7	470 x 220	150	Ni / Au / Si	100 x 130
FCAD50V-5428-T3-E	50	540 x 280	150	Ni / Au / Si	100 x 160
FCAD57V-4121-T1-E	60	410 x 210	150	Ni / Au / Si	90 x 120
FCAD08VP-4121-T7-C	-8/8	415 x 210	110	Au80wt%Sn20wt% / Si	40 x 30 x 2
FCAD12VP-4121-T7-C	-12/12	415 x 210	110	Au80wt%Sn20wt% / Si	40 x 30 x 2
FCAD47VP-4121-T7-C	-47/+47	415 x 210	110	Au80wt%Sn20wt% / Si	40 x 30 x 2

Top Pad : Other pad metals are available on demand